目前招聘岗位为研发工程师、封装工程师、测试工程师、耦合工程师、贴片工程师、样品工程师、PIE工程师、工艺工程师、镀膜工程师等方向

1.有自我驱动力，有志于AI行业者。 2.2027届本科、硕士学历。 3.光学类、封装类、电子信息类、机械类、电气类，自动化类、材料类等理工类专业。 4.具备英文书写能力，CTE-4及以上，英文口语流利优先。 5.拥有良好的沟通协调能力及团队合作精神。 6.具备良好的学习能力及解决问题意愿等。 Qualifications 1. Possess self-motivation and have aspirations in the AI industry. 2. Bachelor's and Master's degrees from the class of 2027. 3. Science and engineering majors such as optics, packaging, electronic information, machinery, electrical engineering, automation, materials, etc. 4. Possess English writing ability, with a CTE-4 or higher certificate, and fluency in spoken English is preferred. 5. Possess excellent communication and coordination skills, as well as a strong team spirit. 6. Possess strong learning capabilities and a willingness to solve problems.