职位概述： 本岗位面向半导体设备材料工程师，为博士毕业生提供成长与技术平台。您将参与陶瓷、金属、有机等新材料及涂层开发、零部件失效分析、供应商质量认证及前沿技术探索。要求扎实的材料科学基础、出色的问题解决能力、对半导体设备技术的浓厚兴趣，能在一定压力下独立解决复杂工程问题。 主要职责： 1. 新材料与涂层研发 负责陶瓷、金属及高分子等先进材料及其表面涂层的研发与工艺优化，满足半导体设备对耐腐蚀、耐高低温、高纯度等严苛性能要求。同时负责撰写技术报告与专利申请文件。 2. 零部件失效分析与持续改进 对刻蚀设备出现的零部件失效问题进行系统性分析，运用SEM、TEM、XPS、FTIR、XPS等材料表征手段分析根本原因，提出并验证改进方案，并推动产品持续迭代。 3. 供应商质量认证与标准建立 参与腔体关键零部件的供应商质量认证，深入供应商生产现场审核其材料制备工艺（如陶瓷烧结、金属锻造、喷涂涂层），主导建立材料标准及可靠性测试方法，支持关键零部件质量稳定性。 4. 前沿技术探索与产品导入 跟踪半导体技术前沿动态，探索新兴技术的应用潜力。通过小批量试制、加速寿命测试及产线验证，推动新技术向下一代刻蚀和薄膜设备转化。 1.New Material and Coating R&D Responsible for the R&D and process optimization of advanced materials (ceramics, metals, polymers) and their surface coatings to meet the stringent performance requirements of semiconductor equipment, such as corrosion resistance, high and low temperature resistance, and high purity. Also responsible for drafting technical reports and patent application documents. 2. Key Component Failure Analysis and Continuous Improvement Conduct systematic failure analysis of components used in etch equipment, identify root causes using characterization tools such as SEM, TEM, XPS, FTIR, XPS, propose and verify improvement solutions, and drive continuous product iteration. 3. Supplier qualification and Spec Establishment Participate in the quality certification of key component suppliers, conduct on-site audits of their material preparation processes (e.g., ceramic sintering, metal forging, spray coating), lead the establishment of material standards and reliability testing methods, and support the quality stability of key components. 4.Frontier Technology Exploration and Product Introduction Track the latest trends in semiconductor technology and explore the application potential of emerging technologies. Through small-batch trial production, accelerated life testing, and production line validation, drive the transition of new technologies into next-generation etch and thin-film equipment. 岗位要求： 1. 材料科学与工程、材料物理与化学、无机非金属材料等相关专业博士毕业生。精通材料热力学、相图、腐蚀与防护，深刻理解材料微观结构-宏观性能的关系。研究方向需与半导体材料、高温结构材料、薄膜技术或失效分析紧密相关。 2. 实验技能与表征能力：熟练操作SEM、XRD、XPS、DSC/TGA、FTIR等分析设备，具备独立完成样品切割、镶嵌、抛光、腐蚀等制样工作的能力。掌握复杂谱图解析与数据分析方法，能够运用DOE（实验设计）方法系统优化工艺参数，并通过多维度交叉验证解决工程问题。 3. 逻辑思维与问题解决能力：具备出色的逻辑推理能力，善于从数据中提炼规律，能够结合多种表征手段快速定位失效根因并提出改进方案。具备在多项目并行、时间紧迫的情况下保持理性判断、攻坚克难的能力。 4. 设备兴趣与协作能力：对半导体设备（如刻蚀机、薄膜沉积设备等）的工作原理、腔室设计及等离子体物理有浓厚兴趣。具备优秀的跨部门沟通能力，能够清晰地向机械设计、系统集成、TPS等非材料背景工程师解释材料问题根因与改进建议。具有强烈的探索意识和主动学习习惯，心理素质过硬，具备在压力下持续攻坚的韧性。 1.Education and Professional Foundation : Ph.D. graduates in Materials Science and Engineering, Materials Physics and Chemistry, Inorganic Non-metallic Materials, or related fields. 2.Experimental Skills and Characterization Capabilities : Proficient in operating analytical equipment such as SEM, XRD, XPS, DSC/TGA, and FTIR. 3.Logical Thinking and Problem-Solving Skills : Possess outstanding logical reasoning abilities, adept at extracting patterns from data, and capable of quickly identifying root causes of failures and proposing improvement solutions by combining multiple characterization techniques. 4. Equipment Interest and Collaboration Skills : Have a strong interest in the working principles, chamber design, and plasma physics of semiconductor equipment (e.g., etchers, thin-film deposition equipment, etc.).