主要职责： 设备硬件系统集成工程师，早期主要参与系统集成测试工作，了解各模块的工作原理和产品特性，逐步培养成为硬件模块专家。后期会根据实际表现，有机会提拔参与设备硬件架构定义及主导产品技术开发。 1. 规划并执行整机研究测试，例如腔体电气参数、热参数监测 2. 规划并执行整机系统集成测试，如耐力测试及ER、PA表征等 3.与相关团队协作开展新功能开发，沟通团队包括设计部门、TPS团队及工艺团队等，工作内容涵盖新功能定义与集成测试 4. 系统地完成测试报告，并提出包含逻辑分析及验证结果的改进建议。 1. Plan and perform on tool lab study test, such as chamber electrical, thermmal parameters monitor 2. Plan and perform on tool lab system integration test, such as burn in test and monitor ER, PA 3. Co-work with related group to do new feature development, such as design group,TPS team and process team including new feature definition and integration test 4. Generate test report systematically and propose improvement proposals with logical analysis. 岗位要求： 1. 理学博士，专业优先物理、化学、材料或相关科学与工程领域 2. 优先考虑有半导体设备公司或行业实习经验的新毕业生 3. 具备逻辑推理能力和问题解决能力培养意愿 4. 高度自律、有责任感、团队协作能力强、乐于分享、积极进取且坚韧不拔 1. PH.D with major in Physics, Chemistry, Materials, or related field in Science and Engineering 2. Fresh graduate and experience in SEMI equipment company or industry is preferred 3. Logic thinking capability and problem solving skills 4. Highly self-motivated, ownership and accountability, team-work skills and willing to sharing, aggressive and resilient