中微半导体设备(上海)股份有限公司
2027届

岗位信息

招聘岗位
2027届-研发技术支持工程师-微显影 TPS Engineer-LSD
工作城市
上海
学历要求
本科
是否笔试
未明确
招聘批次
2027届
发布日期
2026-08-08

📋 岗位职责 / 任职要求

作为涂胶显影设备研发工程师,隶属于设备研发团队,负责下一代光刻配套设备的机械结构设计、硬件性能验证、整机调试优化与迭代升级。结合机械结构、精密传动、温湿度控制、流体气动控制等专业知识,在资深工程师指导下,参与设备方案设计、零部件选型评审、整机装配调试、设备问题分析整改,推进设备研发落地、量产交付与硬件性能迭代提升,可快速积累整机研发项目经验。 主要职责 1. 设备设计指标把控:从方案及结构设计阶段,把控设备核心结构、精密运动机构、温控散热、排风流体、气动管路等关键硬件指标,保障设备整体设计合规、运行稳定,满足设备设计规范与客户整机使用标准。 2. 核心零部件选型评审:根据设备整机性能、结构适配及运行需求,审核机械结构件、气动元件、传感器、温控组件、管路阀体等核心零部件参数,完成选型校核与适配验证,确保零部件精度、稳定性、兼容性符合设备研发及量产标准。 3. 整机验证与迭代改进:制定设备硬件性能测试、调试及验收方案,完成设备运行精度、运动稳定性、重复精度、整机可靠性等全维度验证;针对设备调试、试产、客户端使用过程中出现的硬件故障、结构缺陷、性能偏差,分析根因并输出整改方案,持续迭代优化设备硬件性能与结构设计。 4. 设备整机适配优化:负责设备整机运行参数、运动逻辑、温控、吹扫、排风等硬件参数调试与适配,解决设备结构干涉、机构联动异常、硬件匹配不良等问题,持续提升设备运行稳定性、适配性与量产可靠性。 Main Responsibilities 1. Equipment design index control: Control key hardware indicators including equipment structure, precision motion mechanism, temperature control, exhaust and fluid system in the design phase, to ensure the overall equipment design and operation meet design specifications and customer standards. 2. Core component selection and review: Verify the parameters, structural adaptability and compatibility of mechanical, pneumatic, sensing, temperature control and piping components to meet R&D and mass production requirements of equipment precision and stability. 3. Equipment verification and iterative optimization: Formulate hardware performance test and acceptance standards, conduct full verification on equipment operating accuracy, stability and repeatability. Analyze hardware failures and structural defects during commissioning and customer use, and implement targeted optimization and upgrading. 4. Equipment adaptation and optimization: Debug equipment operating parameters, motion logic, temperature control, purge and exhaust system. Solve structural interference, linkage abnormality and hardware matching problems to improve equipment operating stability and mass production reliability. 岗位要求 一、学历与专业要求 中文:本科及以上学历,应届毕业生;微电子科学与工程、材料科学与工程、化学(物理化学、材料化学优先)、化学工程等相关理工科专业。 English:Bachelor’s degree or above, fresh graduate of 2026 graduation year; majored in Microelectronics Science and Engineering, Materials Science and Engineering, Chemistry (Physical Chemistry, Materials Chemistry preferred), Chemical Engineering and other related science and engineering majors. 二、实操与数据分析能力 中文:具备扎实的设备实操、实验设计与现场调试能力,拥有良好的数据整理、分析及逻辑思维能力,可通过设备运行数据、工艺实验数据排查设备及工艺问题,善于归纳总结设备运维、工艺优化经验。 English:Solid capabilities in equipment practical operation, experimental design and on-site commissioning, with good data sorting, analysis and logical thinking abilities. Able to troubleshoot equipment and process problems through equipment operation data and process experimental data, and good at summarizing equipment operation and maintenance as well as process optimization experience. 三、英文能力 中文:具备良好的英文读写能力,可熟练阅读半导体设备专业文献、设备手册及相关技术文档。 English:Good English reading and writing skills, proficient in reading professional literature, equipment manuals and relevant technical documents of semiconductor equipment. 四、专业工艺认知 中文:熟悉半导体制造基础工艺流程,重点了解光刻、湿法相关工艺原理及配套设备运行逻辑。 English:Familiar with the basic semiconductor manufacturing processes, with a key understanding of the principles of lithography and wet processes as well as the operation logic of supporting equipment. 五、优先条件 中文:有半导体track设备、清洗设备及相关工艺设备操作、运维、调试经验者优先。 English:Candidates with experience in operating, maintaining and commissioning semiconductor track equipment, cleaning equipment and other related process equipment are preferred. 六、职业素养与安全意识 中文:热爱半导体设备行业,具备极强的学习意愿和自主学习能力;工作严谨细致、责任心强,严格恪守设备操作规范,具备扎实的设备运维安全意识。 English:Passionate about the semiconductor equipment industry with strong learning willingness and independent learning ability. Meticulous and rigorous in work with a strong sense of responsibility, strictly abides by equipment operation specifications, and has solid safety awareness for equipment operation and maintenance. 七、抗压与问题解决能力 中文:求知欲强、自驱力突出,面对设备故障、复杂工艺适配难题,具备主动攻坚的韧性、良好的抗压能力和问题解决能力。 English:Strong intellectual curiosity and self-motivation. Possess the tenacity of active tackling difficulties, good pressure resistance and problem-solving abilities when facing equipment failures and complex process adaptation problems. 八、沟通与协作能力 中文:工作积极主动,具备良好的沟通表达、跨岗位对接能力和团队协作精神,可高效配合团队完成设备调试、工艺优化及产线运维工作。 English:Proactive in work, with good communication and expression skills, cross-post docking capabilities and team spirit, able to efficiently cooperate with the team to complete equipment commissioning, process optimization and production line operation and maintenance work.

🏢 企业简介

总部上海

投递方式

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🎯 AI校招画像 (来源:DeepSeek AI搜索)

🏢 公司文化与工作氛围
半导体刻蚀设备龙头企业,科创板上市。企业文化技术驱动,强调自主创新,创始人尹志尧为半导体行业知名科学家。
⏰ 加班情况与工作强度
研发岗有项目攻关压力,半导体行业节奏快。但薪酬回报高,核心研发人员有股权激励。
💰 薪资待遇与年终奖
本科15-20K/月,硕士综合年薪22-35万,博士38-55万起步。14-17薪,含固定底薪+绩效+项目攻关奖+年终分红。核心研发可获股权激励。
🎁 福利体系
市场导向有竞争力薪酬,年度奖金基于个人及团队业绩,薪酬调整机制完善。
📋 校招流程经验
网申→职业测评→HR及业务综合面试→offer。博士有提前批。
🚀 投递建议与避坑指南
上海浦东总部为主,南昌、成都、广州、武汉、合肥、北京、深圳、厦门、泉州有岗位。机械、电子、材料、物理、计算机等专业需求大。半导体设备行业前景好,适合技术深耕。
👥 员工口碑与离职率评价
员工反馈研发岗待遇优厚,股权激励力度大。技术成长快,接触半导体最前沿工艺。
📈 热门岗位方向与招聘趋势
2027'登峰计划'校招,6大职类开放投递。半导体设备国产化大背景下持续扩招,射频、控制、工艺方向需求大。

ℹ️ 信息来源

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