职位概述： 作为现场设备支持工程师，你将加入我们充满活力的半导体设备现场服务团队。你将学习并运用物理、材料科学、化学等多学科知识，在资深工程师的指导下，参与先进半导体设备现场安装，调试，解决客户现场问题；配合现场工艺和研发团队，持续改进机台性能，优化设备性能；配合销售团队，了解行业动态，抢占更多市场份额。这是一个充满挑战性的工作岗位：高抗压，快速反应，持续学习，团队合作并能实现快速自我成长并实现个人价值。 主要职责： 1.完成现场装机任务，配合工艺工程师，满足客户验机要求。 2. 维护客户现场设备，能够独立完成各种BKM操作 3.和研发团队紧密合作，评估更多新研发机台，评估各种现场硬件升级项目，满足客户长期目标。 4.作为客户和产品团队的联系桥梁，需要时刻和客户保持良好关系，充分沟通 5.帮助公司销售团队了解更多现场情况 （如竞争对手状态，客户产线增长情况等），抢占更多市场份额 6.必要情况需要出差以支援其他技术服务团队 1. Performs all standard service activities through Tier I unassisted and can performs standard Tier II with assistance. 2. Able to perform BKM unassisted and follow all IP guidelines 3. Support tool maintenance and able to perform routine preventative maintenance within established timeframes 4. Responds to fab issues and perform trouble shooting in customer site with limited assistance 5. Applies diagnostic techniques and use of documentation and test equipment with assistance from Sr. engineers. 6. Co-work and build up good relationship with customer, and handle customer request with limited assistance 7. Need to travel within China for customer support if needed. 8. Other tasks assigned by supervisor 1. 具备完成任务和解决问题的能力，必要时可提供有限协助 2. 需要良好的工作态度和沟通能力 3. 了解所分配职责与团队中其他成员之间的关系，有出色的团队合作能力 4. 出色的抗压能力 1. Have capability of carrying out tasks and problem solving, limited assistance if really needed 2. Good working attitude and communication skill is required 3. Understands how the assigned duties relate to others in the team 4. Outstanding stress-resistance ability