中微半导体设备（上海）股份有限公司

Key responsibilities 主要职责： 1. 表征工艺性能； 2. 采集机台参数的工艺趋势； 3. 撰写机台相关BKM； 4. 为客户做DEMO，并展示工艺结果； 5. 为产品设计组反馈硬件的工艺性能 1.Characterization of process using test wafers. 2.Collect process trends when varying various parameters. 3.Establish BKMs to achieve good deposition uniformity and other process indicators, etc. 4.Conduct customer demos, and demonstrate good process on test wafers 5.Document test results and feedback process performance to design group for hardware optimization Key requirement 资历要求 : 1. 博士或硕士学历，物理，化学，等离子体，材料专业等 2. 理解熟悉刻蚀原理或工艺，有fab相关经验更佳； 3. 良好的沟通和展示技巧； 4. 良好的英语说写能力； 5. 独立完成工作，具有团队精神； 1.PhD or Master or equivalent in physics, chemistry, plasma engineering, material, ee. 2.Understanding the etch principle and process; Fab experience is preferred; 3.Good communication and presentation skills; 4.Fluent English both in spoken and written, Good skills for office software (word,excel, ppt and etc); 5.Independent work ability and have team work spirit.