岗位要求： 1.负责/参与 PECVD 工艺设备（如反应腔、喷淋头、真空系统、高温加热系统、射频系统、冷却系统、气体输送系统、运动部件、框架系统、材料选择等）开发与设计工作。 2.机械部件的 3D 设计和 2D 图纸绘制、BOM制作、技术文件的准备以及部件的清洁度检查、质量改进、成本降低工作。 3.与供应商沟通有关零部件的制造工艺和测试方法，跟进零部件的生产进度，确保零部件达到设计和使用要求。可以进行低频率的出差至供应商进行技术沟通和技术支持。 4.对零部件故障进行分析和改进，快速给出有效的解决方案。进行对零部件持续的可靠性、稳定性、重复性改进设计（如耐腐蚀性、提高零件寿命、低颗粒污染等）。 5.与产品组内部、电气、仿真、材料、采购、测试组、生产组等公共部门进度高效合作，加快半导体产品的开发进程。 6.配合团队中的资深工程师开展设计工作。 1. Responsible for or involved in the development and design of PECVD process equipment, including reaction chambers, showerheads, vacuum systems, high-temperature heating systems, RF systems, cooling systems, gas delivery systems, moving components, frame systems, material selection, etc. 2. Perform 3D design and 2D drawing creation for mechanical components, prepare BOMs, technical documentation, conduct cleanliness inspections, drive quality improvements, and reduce costs. 3. Communicate with suppliers regarding manufacturing processes and testing methods for components, monitor production schedules, and ensure parts meet design and performance requirements. Occasional travel to suppliers may be required for technical discussions and support. 4. Analyze component failures and implement improvements, quickly providing effective solutions. Continuously enhance component reliability, stability, and repeatability through design improvements (e.g., corrosion resistance, extended part life, reduced particulate contamination). 5. Collaborate efficiently with internal teams such as product groups, electrical, simulation, materials, procurement, testing, and manufacturing departments to accelerate semiconductor product development. 6. Support senior engineers in design tasks within the team. 岗位职责： 1. 教育背景：硕士及以上学历。 2. 专业/能力要求：擅长机械设计（solidworks 熟练者佳）；可以进行方案设计、分系统设计、结构设计、材料选型、加工工艺选取、设计计算分析等；具备热设计分析、流体分析、电磁射频、材料及材料成型等相关理论知识储备者更佳。 3. 可以熟练应用办公软件高效的进行技术文件编制，具备良好的英文阅读能力，可以阅读英文技术资料，英语流利者优先（包括阅读、写作和口语）。 4. 善于团队合作，具有高度的责任心和使命感，具备良好的职业素养，遵守组织管理规定。 5. 具备与跨部门团队（包括内部和外部团队）合作的能力。对半导体设备的研发有强烈的热情。 1. Educational Background: Master's degree or higher. 2. Professional/Competency Requirements: Proficient in mechanical design (proficiency in SolidWorks is preferred); capable of conducting conceptual design, subsystem design, structural design, material selection, process planning, and design calculations and analysis; candidates with theoretical knowledge in thermal design analysis, fluid dynamics, electromagnetic RF, materials, and material forming are highly preferred. 3. Proficient in using office software to efficiently prepare technical documentation; strong English reading ability required to comprehend technical documents; fluency in English (including reading, writing, and speaking) is a plus. 4. Strong team player with high sense of responsibility and mission; demonstrates excellent professional ethics and adheres to organizational management policies. 5. Capable of collaborating effectively with cross-departmental teams (both internal and external); passionate about semiconductor equipment research and development.