中微半导体设备（上海）股份有限公司

职位概述： 作为刻蚀产品技术方案研发工程师，你将加入我们充满活力的刻蚀设备研发团队，专注于下一代先进刻蚀设备工艺的开发、优化与验证工作。你将学习并运用等离子体物理、材料科学、化学等多学科知识，在资深工程师的指导下，参与实验设计、工艺调试、数据分析及问题解决，为提升设备性能、满足客户严苛的工艺需求贡献力量。这是一个将理论知识应用于尖端半导体制造实践、快速成长并实现个人价值的绝佳平台。 主要职责： 1.工艺开发与优化： 在指导下，参与特定材料刻蚀工艺配方的开发、调试和优化工作。 2.实验执行与数据分析： 操作刻蚀设备，进行各种刻蚀实验；收集、整理和分析实验数据，撰写实验报告。 3.工艺问题解决： 协助调查和解决工艺开发及客户验证过程中遇到的技术问题（如刻蚀速率异常、均匀性差、选择比低、缺陷等），提出改进方案。 4.改善设备性能：与其他组（如软件组、机械设计组）通力合作，测试机台，反馈结果，提出改善意见，改善设备性能。 5.工艺窗口评估： 参与评估工艺参数的窗口（Window），分析工艺的稳定性、重复性和鲁棒性。 1. Process Development and Optimization: Participate in the development, tuning, and optimization of etching process recipes for specific materials under guidance,. 2. Experimental Execution and Data Analysis: Operate etching equipment to conduct various etching experiments; collect, organize, and analyze experimental data, and prepare experiment reports. 3. Process Problem Solving: Assist in investigating and resolving technical issues encountered during process development and customer validation and propose improvement solutions. 4. Equipment Performance Improvement: Collaborate closely with other teams (such as software and mechanical design groups) to test equipment, provide feedback on results, and suggest improvements to enhance equipment performance. 5. Process Window Evaluation: Participate in evaluating process parameter windows, analyzing process stability, repeatability, and robustness. 岗位要求： 1.博士学历，材料科学与工程、物理（等离子体物理、凝聚态物理优先）、化学（物理化学、材料化学优先）、化学工程等相关理工科. 2.具备较强的抗压能力和解决问题的韧性。 1. Ph.D. degree, fresh graduate (expected graduation date: 2027). Relevant fields include Materials Science and Engineering, Physics (with preference for plasma physics and condensed matter physics), Chemistry (with preference for physical chemistry and materials chemistry), Chemical Engineering, or other related science and engineering disciplines. 2. Possesses strong stress resistance and resilience in problem-solving.