We are looking for an Inspection Application Engineer to join our applications team. You will be the technical bridge between our wafer inspection products and our customers — developing inspection solutions, optimizing tool performance at customer sites, and feeding field insights back to R&D to shape the next generation of our products. Key Responsibilities • Provide application support for our wafer defect inspection systems at customer sites, including post-installation recipe development, inspection parameter optimization, and capture rate / nuisance rate tuning to drive tools through customer acceptance; • Develop and deliver standardized inspection application solutions tailored to customer process flows and production needs across logic, memory, power device, and advanced packaging applications; • Plan and execute tool performance and algorithm characterization during beta tests, head-to-head benchmarks, and new product introduction (ramp) phases, delivering clear product improvement feedback to the R&D team; • Respond to customer technical requests; independently diagnose and resolve application issues of low-to-medium complexity (troubleshooting), and provide escalation support to Field/Customer Service Engineers (FSE/CSE); • Deliver product demonstrations (demos) and customer training on tool operation and inspection workflows; create and maintain technical documentation including BKMs (Best Known Methods), application notes, and demo reports; • Collect customer application feedback and competitive intelligence; propose new features and product requirements from an application perspective; support marketing and sales teams in articulating product value; • Track technology trends in inspection algorithms and image processing; participate in application-level validation and deployment of automated defect classification (ADC) and image analysis algorithms. Qualifications: Education: • Master's degree or above in Computer Science (image processing / computer vision), Precision Instrumentation, Automation, Microelectronics / Semiconductor Process, or a related field; Knowledge & Skills: • Familiar with image processing and machine vision; familiarity with common image processing algorithms and frameworks (e.g., OpenCV); experience with deep-learning-based defect detection/classification is a plus; • Familiar with semiconductor manufacturing processes (lithography, etch, thin film, CMP, etc.) with a basic understanding of wafer defect types and yield management; • Proficient in at least one programming language (Python / C++ / MATLAB) with data analysis skills (JMP or SQL experience is a plus); • Understanding of precision optics, precision motion control, and mechatronic system fundamentals, with the ability to analyze system-level issues across optics, mechanics, electronics, and software; Experience: • Fresh Master graduates or candidates with 1–3 years of semiconductor industry experience are both welcome; • Prior application or process integration experience with inspection/metrology tools (brightfield/darkfield defect inspection, EBI, Review SEM, CD-SEM, etc.) • Experience in fab process integration (PIE), yield enhancement (YE), or defect analysis (FA/DA) is a plus.