德州仪器-成都制造基地
实习民企

岗位信息

招聘岗位
2027校招-Analog FAE现场技术应用工程师轮岗项目-模拟方向
工作城市
成都
是否笔试
未明确
招聘批次
实习
截止日期
招满即止

📋 岗位职责 / 任职要求

Change the world. Love your job. Open for 2025-2027 graduates,欢迎应届生及0-2年工作经验候选人投递。 When you join TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. TI's FAST (Field Applications & Sales Training) Program is designed to prepare Sales & Applications team members for customer-oriented careers that pair technical skills with business perspectives. The program provides experiences that help rising TIers understand how to successfully grow TI's business and to thrive throughout their entire TI career. There are two available FAST program tracks: (1) Field Applications and (2) Technical Sales. Field Applications Engineer track This 12-month experience aims to establish rising Field Applications Engineers (FAEs) as technical TI experts with customer engineers and internal teams. The track includes 3 rotations and an international headquarter experience: Rotation 1, Field Sales Office (FSO): The FSO rotation is centered on learning how to work directly with customers to solve technical challenges, and to ultimately maximize TI's revenue by providing customers with the systems-level solutions that best address their design needs. Among other aspects, the FSO rotation focuses on analyzing technical trade-offs, understanding component selection, and solving design and cost challenges. Rotation 2, Mass Market (MM): The MM rotation is designed to train FAEs on how to scale any action within a given sector or EE across multiple customers. Rotators will participate in innovative projects to help create new and more efficient sales processes. This rotation focuses on learning how to leverage TI’s resources, automation, practice scalable selling techniques, decision making in imperfect circumstances, and direct customer interactions. Rotation 3, Business Unit/Systems Engineering & Marketing (BU/SEM): This rotation provides hands-on experiences that help future FAEs understand how various TI components fit together to provide systems-level solutions for customer designs. Rotators will be trained on business acumen, technical capabilities, and processes for new product definition and introduction. This rotation focuses on technical product selection, schematic/layout capture, PCB layouts, fabrication processes, board bring up and validation. Headquarter Experience: The FAST program will conclude with “Headquarter Experience” at our global headquarters in Dallas, Texas. During this immersive experience, participants will build multi-level networks with key stakeholders and support functions, gain firsthand exposure to our Dallas campus, and learn how to effectively leverage the full range of company resources to drive future success. Upon successful completion of the Field Applications Engineer track, rotators are welcomed as FAEs on TI's Worldwide Sales & Applications team. FAE responsibilities include: - Using various sales tools and relationships with design engineering to identify all potential projects - Providing customers with proactive proposals for complete, system-level solutions that maximize TI content - Using broad technical expertise to influence customers' part selection process while favorably positioning TI versus competition Texas Instruments will not sponsor job applicants for visas or work authorization for this position. Minimum requirements: - Bachelors degree in Electrical Engineering, Electronics Technology, Electrical Engineering Technology, Electrical and Computer Engineering or related field - Fluent in local language and English, both written and oral communication skills - Basic understanding of schematics, layouts and digital components - Knowledge and understanding of analog circuitry (examples include: op-amps, DC/DC power, data converters, sensing, etc.) - Experience with lab equipment, like oscilloscopes, along with soldering and debugging skills Preferred qualifications: - Experience with lab equipment such as oscilloscopes, along with soldering and debugging skills - Programming skills in C/C++ (LabView recommended) - Demonstrated strong analytical and problem solving skills - Excellent communication and presentation skills - Ability to work in teams and collaborate effectively with people in different functions - Strong time management skills that enable on-time project delivery - Ability to build lasting, influential relationships, both inside and outside the organization - Ability to work effectively in a fast-paced and ever-changing environment - Ability to take initiative and drive for results - Ability to influence decisions through a sense of urgency and competitive drive

投递方式

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🎯 AI校招画像 (来源:百度AI搜索+DeepSeek)

🏢 公司文化与工作氛围
成都制造基地是TI全球唯一端到端制造基地,集晶圆制造、凸点加工、晶圆测试、封装测试于一体,2023年产值破百亿,员工超1800人。公司提供1v1导师制,有职业加速发展计划(Career Accelerator Program),面向全部岗位招生。核心价值观强调通过半导体技术让电子产品更经济实用,让世界更美好,致力于推动工程进步。团队氛围方面强调协作、沟通和快速学习能力,实行全球化视野与全产业链了解的人才培养导向,并提供全球轮岗机会。上下级关系在材料中未做详细描述,但1v1导师制体现了对新人成长的重视。
⏰ 加班情况与工作强度
成都制造基地生产制造类岗位实行倒班制,上班两天休息两天,日班与夜班每60天轮换一次。日班时间为7:45-20:00,夜班时间为19:45-次日8:00,即每班12小时。生产操作员岗位需接受12小时无尘室站立式工作(需佩戴口罩和手套、穿无尘服、戴防护眼镜),适应倒班(上二休二、白班夜班两个月轮换一次)。制造部主管岗位需倒班。厂务、设备、工艺等技术员岗位同样需适应倒班工作。无尘室为恒温生产车间,需穿着连体无尘服工作。研发类岗位的工作强度未在材料中详细说明。
💰 薪资待遇与年终奖
职友集对TI成都的统计显示,薪酬区间在8K-20K之间,其中75%的岗位拿10K-20K,本科工资约15.0K。2026年较上年薪资增长59%,数据来自近一年16条工资样本,取决于岗位样本。知乎来源的招聘信息显示,应届生20-30K起,技术岗年薪50万以上。生产制造类岗位薪酬结构包括:基本工资、全勤奖、住房补贴、轮班津贴、加班工资、十三薪、年度员工分红、年度调薪。生产操作员岗位为正式工,与公司直签合同,收入由底薪+住房补贴(不提供住宿)+十三薪+全勤奖+轮班津贴+加班费+员工分红构成。年终奖相关信息体现为十三薪与年度员工分红,另有利润分享(年化10%以上)的说法。需要说明的是,薪资数据来源存在差异:职友集样本显示本科约15K,而知乎来源称应届生20-30K起,可能因统计口径和岗位类型不同所致。
🎁 福利体系
五险一金齐备,另有补充商业保险(生产操作员岗位描述为五险一金,知乎来源称六险二金)。住房补贴在多个岗位描述中出现(生产操作员不提供住宿但发放住房补贴)。餐补、免费班车、全勤奖均有提及。带薪年假为每年12-20天全薪年假,另有育儿假。节日福利包括节假日福利、结婚新生儿礼金。年度体检、员工活动均有提供。成都/上海/深圳提供住宿的说法来自知乎来源,但Boss直聘的生产操作员岗位明确说明不提供住宿、发放住房补贴,两者存在口径差异。
📋 校招流程经验
校招流程为网申到面试到offer的方式,投递通过电脑端网址(https://app.mokahr.com/su/vjlqkz)或手机端通过微信搜索"德州仪器芯招聘"公众号进行。2027届应届生招聘对象为2027年毕业生,2025-2026年毕业生(少于24个月工作经验)同样可以申请。面试和笔试的详细流程、每轮面试内容、通过率、节奏快慢在参考材料中未提供。公司设有面向全部岗位的职业加速发展计划(Career Accelerator Program),体现系统化培养体系的特征。
🚀 投递建议与避坑指南
成都制造基地在2027届校招中开放岗位分为两大类:生产制造类岗位包括设备工程师、工艺工程师、产品工程师、质量工程师、制造部主管(需倒班)、封装工程师、模拟芯片测试工程师、量产产品生产管控部门工程师、工业工程师;业务支持类岗位包括财务专员、生产计划工程师、供应链专员、人力资源培训生、项目IT软件自动化工程师、采购专员。技术员级别的招聘面向大专及以上学历,要求电子/机械/电气/汽车等理工科专业(设备技术员)、电子/材料/物理等理工科专业(工艺技术员)、机械/电气/气体化学及水系统等理工科专业(厂务技术员)。生产操作员岗位学历要求为高中/中专/技校(专业不限)。简历加分项包括理工科专业背景、基本的英文能力、熟练掌握Word/Excel/PowerPoint等办公软件、主动性强、动手能力强、良好的沟通表达和团队协作能力。需要注意工作环境为无尘室,需穿着连体无尘服。生产制造类岗位普遍需要适应倒班(上二休二,每班12小时),求职者需要评估自身对倒班制度和洁净室环境的适应能力。
👥 员工口碑与离职率评价
从公司发展角度看,成都基地是TI全球唯一端到端制造基地,2023年产值破百亿,员工超1800人,且公司决定增建新的封装测试厂房并于2021年竣工,设备正在按计划安装调试中,处于扩产期,员工晋升速度较快(知乎来源称"成都基地扩产中晋升快")。培养体系方面提供1v1导师制和全球轮岗机会,有利于员工成长。离职原因与员工推荐度方面缺乏具体数据。
📈 热门岗位方向与招聘趋势
成都制造基地处于明确扩产阶段:2010年设立晶圆制造厂,2014年建立封装测试厂,2016年建成凸点加工厂,2018年晶圆测试厂扩建项目交付使用,同年决定增建新的封装测试厂房,2021年竣工后设备正在按计划安装调试中。招聘趋势上,2027届校招覆盖生产制造类和业务支持类共16个岗位方向,其中模拟芯片测试工程师、封装工程师、设备工程师等岗位直接对应制造基地的核心业务环节(晶圆制造、凸点加工、晶圆测试、封装测试)。2026年薪资较上年增长59%(职友集样本数据),体现薪资上行趋势。技术方向覆盖工业、汽车、消费电子、数据中心、个人电子产品和通信设备等市场,特斯拉、苹果、SpaceX等企业均使用TI芯片。机会较多的方向集中在模拟芯片和嵌入式处理芯片的制造、测试与封装相关岗位。

ℹ️ 信息来源

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